Package Warpage and Stress Evaluation for a Plastic Electronic Package
Chang, Chia Lung, Chiou, Chia HueiVolume:
33-37
Year:
2008
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/amr.33-37.1327
File:
PDF, 355 KB
english, 2008