Development of a thermopile infrared sensor using stacked...

Journal of Micromechanics and Microengineering 2013 / 06 Vol. 23; Iss. 6

Development of a thermopile infrared sensor using stacked double polycrystalline silicon layers based on the CMOS process

Zhou, Huchuan, Kropelnicki, P, Tsai, J M, Lee, Chengkuo
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Volume:
23
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/23/6/065026
Date:
June, 2013
File:
PDF, 2.55 MB
english, 2013
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