![](/img/cover-not-exists.png)
[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Prediction of Solder Joint geometry for Optical Fiber attachment Assembly in Direct-Coupling Applications
Zhang Wei,, Wang Chunqing,, Tian Yanhong,Year:
2005
Language:
english
DOI:
10.1109/icept.2005.1564649
File:
PDF, 238 KB
english, 2005