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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - On reliability of chips bonded on flex substrates using thermosonic flip-chip bonding process with nonconductive paste
Chuang, Cheng-Li, Aoh, Jong-Ning, Chen, Wei-HowYear:
2009
Language:
english
DOI:
10.1109/icept.2009.5270654
File:
PDF, 5.60 MB
english, 2009