Very High-Temperature Joints Between Si and Ag–Copper...

IEEE Transactions on Components and Packaging Technologies 2008 / 12 Vol. 31; Iss. 4

Very High-Temperature Joints Between Si and Ag–Copper Substrate Made at Low Temperature Using InAg System

Kim, Jong Sung, Wang, Pin J., Lee, Chin C.
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Volume:
31
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2008.2001195
Date:
December, 2008
File:
PDF, 2.12 MB
english, 2008
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