Numerical Analysis on Compliance and Electrical Behavior of...

IEEE Transactions on Advanced Packaging 2006 / 05 Vol. 29; Iss. 2

Numerical Analysis on Compliance and Electrical Behavior of Multi-Copper-Column Flip-Chip Interconnects for Wafer-Level Packaging

Liao, E.B., Tay, A.A.O., Ang, S.S., Feng, H.H., Nagarajan, R., Kripesh, V.
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Volume:
29
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2005.853556
Date:
May, 2006
File:
PDF, 1.21 MB
english, 2006
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