[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - Kinetic modeling of no-flow underfill cure and its relationship to solder wetting and voiding
Hurley, J.M., Berfield, T., Ye, S., Johnson, R.W., Renzhe Zhao,, Guoyun Tian,Year:
2002
Language:
english
DOI:
10.1109/ectc.2002.1008196
File:
PDF, 638 KB
english, 2002