Packaging for RF MEMS devices using LTCC substrate and BCB...

Journal of Micromechanics and Microengineering 2006 / 01 Vol. 16; Iss. 1

Packaging for RF MEMS devices using LTCC substrate and BCB adhesive layer

Kim, Ki-Il, Kim, Jung-Mu, Kim, Jong-Man, Hwang, Gun-Chul, Baek, Chang-Wook, Kim, Yong-Kweon
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Volume:
16
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/16/1/020
Date:
January, 2006
File:
PDF, 969 KB
english, 2006
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