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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Effect of electromigration on interfacial reaction of Cu/Sn3.0Ag0.5Cu/Ni solder joint at high temperature
Chen, Leida, Huang, Mingliang, Zhou, Shaoming, Ye, Song, Ye, Yuming, Wang, Jifan, Cao, XiYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066843
File:
PDF, 2.34 MB
english, 2011