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[IEEE 2007 15th International Conference on Advanced Thermal Processing of Semiconductors - Cannizzaro, Catania, Italy (2007.10.2-2007.10.5)] 2007 15th International Conference on Advanced Thermal Processing of Semiconductors - The Reflectivity enhancement of Ni/Ag/(Ti or Mo)/Au Ohmic Contact for Flip-Chip Light-Emitting Diode Applications
Chang, Liann-Be, Shiue, Ching-Chuan, Jeng, Ming-JerYear:
2007
Language:
english
DOI:
10.1109/rtp.2007.4383839
File:
PDF, 949 KB
english, 2007