A New Model for Permeability of Porous Medium in the Case...

IEEE Transactions on Components Packaging and Manufacturing Technology 2014 / 8 Vol. 4; Iss. 8

A New Model for Permeability of Porous Medium in the Case of Flip-Chip Packaging

Yao, Xing Jun, Wang, Zhengdong, Zhang, Wenjun, Zhou, Xingyan
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Volume:
4
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2014.2316537
Date:
August, 2014
File:
PDF, 4.78 MB
english, 2014
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