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[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - A Comparative Study on Thermal and Mechanical Fatigue Behavior for Lead-Free Solder Joints
Kim, Ilho, Lee, Soon-BokYear:
2006
Language:
english
DOI:
10.1109/emap.2006.4430630
File:
PDF, 10.05 MB
english, 2006