[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Through Silicon Via interposer for millimetre wave applications
Lim, Teck Guan, Khoo, Yee Mong, Selvanayagam, Cheryl Sharmani, Ho, David Soon Wee, Li, Rui, Zhang, Xiaowu, Shan, Gao, Zhong, Xiong YongYear:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898570
File:
PDF, 771 KB
english, 2011