Room Temperature Wafer Bonding Using Oxygen Plasma...

Room Temperature Wafer Bonding Using Oxygen Plasma Treatment in Reactive Ion Etchers With and Without Inductively Coupled Plasma

Sanz-Velasco, Anke, Amirfeiz, Petra, Bengtsson, Stefan, Colinge, Cindy
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Volume:
150
Year:
2003
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.1536182
File:
PDF, 1.06 MB
english, 2003
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