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[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - A TSV last integration approach with wafer level pre-patterned adhesive bonding
Zhu, Yunhui, Ma, Shenglin, Sun, Xin, Cui, Qinghu, Zhong, Xiao, Bian, Yuan, Chen, Jing, Miao, Min, Jin, YufengYear:
2012
Language:
english
DOI:
10.1109/estc.2012.6542115
File:
PDF, 5.90 MB
english, 2012