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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Discoloration mechanism of silver-filled adhesive used for packaging solder joint
Rao, Zhenzhen, Bao, Shengxiang, Lai, Weiming, Shi, Guanghua, Li, Peng, Ye, JianhaiYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066968
File:
PDF, 1.68 MB
english, 2011