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[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Chip cracks during assembly: Finding and eliminating the critical defect
Sauter, Wolfgang, Kaldor, Steffen, Clark, Jennifer, Laforte, Stephane, McCarthy, Clare, Restaino, Darryl, Casey, Jon, Questad, DavidYear:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898559
File:
PDF, 1.46 MB
english, 2011