[IEEE 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Belgium (2014.04.7-2014.04.9)] 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Assessment of microelectronics interconnect reliability - current practice and trends
Borgesen, PeterYear:
2014
Language:
english
DOI:
10.1109/eurosime.2014.6813880
File:
PDF, 85 KB
english, 2014