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[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Impact of isothermal aging on Sn-Ag-Cu solder interconnect board level high G mechanical shock performance
Lee, Tae-Kyu, Xie, Weidong, Liu, Kuo-ChuanYear:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898565
File:
PDF, 3.02 MB
english, 2011