[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Modeling of copper wire bonding ball transient temperature behavior
Wang, Techun, Zheng, QingYi, Yu, Rui, Li, ZhongyunYear:
2009
Language:
english
DOI:
10.1109/icept.2009.5270720
File:
PDF, 824 KB
english, 2009