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A novel flip chip technology using nonconductive resin sheet
Ito, S., Mizutani, M., Noro, H., Kuwamura, M., Prabhu, A.Volume:
22
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.774722
Date:
June, 1999
File:
PDF, 545 KB
english, 1999