[IEEE 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Como, Italy (24-26 April 2006)] 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - High Speed Pull Test Characterization of BGA solder joints
Valota, A.T., Losavio, A., Renard, L., Vicenzo, A.Year:
2006
Language:
english
DOI:
10.1109/esime.2006.1644005
File:
PDF, 5.87 MB
english, 2006