![](/img/cover-not-exists.png)
Frequency Effect of Pulse Plating on the Uniformity of Copper Deposition in Plated Through Holes
Tsai, Wen-Ching, Wan, Chi-Chao, Wang, Yung-YunVolume:
150
Year:
2003
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.1560942
File:
PDF, 471 KB
english, 2003