[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou, China (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Bandwidth expansion and slow-wave effect achievement of bond wire interconnection on LTCC substrate
Zhou, Bo, Sheng, Weixing, Wang, HaoYear:
2011
Language:
english
DOI:
10.1109/edaps.2011.6213727
File:
PDF, 448 KB
english, 2011