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[IEEE Advances in Electronic Materials and Packaging 2001 - Jeju Island, South Korea (19-22 Nov. 2001)] Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) - Effects of plasma cleaning on the reliability of wire bonding
Nowful, J.M., Lok, S.C., Ricky Lee, S.-W.Year:
2001
Language:
english
DOI:
10.1109/emap.2001.983955
File:
PDF, 907 KB
english, 2001