[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - Mechanical behaviour and fatigue of copper ribbons used as solar cell interconnectors
Wiese, Steffen, Meier, Rico, Kraemer, FrankYear:
2010
Language:
english
DOI:
10.1109/esime.2010.5464551
File:
PDF, 1.33 MB
english, 2010