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[IEEE 2011 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2011) - Incheon, Korea (South) (2011.07.4-2011.07.7)] 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Novel sample preparation techniques in exposing die backside on molded packages
Mendaros, Raymond, Capito, EugeneYear:
2011
Language:
english
DOI:
10.1109/ipfa.2011.5992743
File:
PDF, 377 KB
english, 2011