[IEEE First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. - Potsdam, Germany (21-24 Oct. 2001)] First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) - Interfacial fracture toughness tests suited for reliability enhancements of advanced plastic packages
Auersperg, J., Kieselstein, E., Schubert, A., Michel, B.Year:
2001
Language:
english
DOI:
10.1109/polytr.2001.973273
File:
PDF, 525 KB
english, 2001