A Study on the Thermal Fatigue Behavior of Solder Joints...

IEEE Transactions on Components and Packaging Technologies 2008 / 03 Vol. 31; Iss. 1

A Study on the Thermal Fatigue Behavior of Solder Joints Under Power Cycling Conditions

Se Young Yang,, Ilho Kim,, Soon-Bok Lee,
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Volume:
31
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2007.906294
Date:
March, 2008
File:
PDF, 3.11 MB
english, 2008
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