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[IEEE 1995 Proceedings. 45th Electronic Components and Technology Conference - Las Vegas, NV, USA (21-24 May 1995)] 1995 Proceedings. 45th Electronic Components and Technology Conference - Ultra-thin and crack-free bottom leaded plastic (BLP) package design
Ki-Bon Cha,, Young-Gon Kim,, Teck-Kyu Kang,, Dae-Soon Kang,, Sung-Dae Baek,Year:
1995
Language:
english
DOI:
10.1109/ECTC.1995.514388
File:
PDF, 671 KB
english, 1995