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[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - An analysis of local deformation of SnAgCu solder joint using digital image correlation
Nobuyuki Shishido,, Toshifumi Kanno,, Shinya Kawahara,, Toru Ikeda,, Noriyuki Miyazaki,, Lu, Hua, Bailey, Chris, Thomas, Owen, Di Maio, Davide, Hunt, ChrisYear:
2010
Language:
english
DOI:
10.1109/icept.2010.5582845
File:
PDF, 1.13 MB
english, 2010