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[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Experimental investigation of high performance thermal module with dimple vortex generators
Yang, Kai-Shing, Wun, Kuo-Liang, Chen, Ing Youn, Wang, Chi-ChuanYear:
2010
Language:
english
DOI:
10.1109/impact.2010.5699525
File:
PDF, 125 KB
english, 2010