Determination of Measurement Limit for Open Solder Bumps on...

IEEE Transactions on Advanced Packaging 2006 / 02 Vol. 29; Iss. 1

Determination of Measurement Limit for Open Solder Bumps on a Flip-Chip Package Using a Laser Ultrasonic Inspection System

Erdahl, D.S., Ume, I.C.
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Volume:
29
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2005.850508
Date:
February, 2006
File:
PDF, 784 KB
english, 2006
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