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[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Wafer Level Camera technology - from wafer level packaging to wafer level integration
Han, Hongtao, Kriman, Moshe, Boomgarden, MarkYear:
2010
Language:
english
DOI:
10.1109/icept.2010.5582473
File:
PDF, 1006 KB
english, 2010