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[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - Effects of metal-cap coverage on electro-migration (EM) tolerance for scaled-down Cu interconnects
Ueki, M., Nakazawa, E., Kitao, R., Hiroshima, S., Kurokawa, T., Furutake, N., Yamamoto, H., Inoue, N., Tsuchiya, Y., Hayashi, Y.Year:
2011
Language:
english
DOI:
10.1109/iitc.2011.5940294
File:
PDF, 409 KB
english, 2011