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[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Highly-conformal plasma-enhanced atomic-layer deposition silicon dioxide liner for high aspect-ratio through-silicon via 3D interconnections
Civale, Yann, Redolfi, Augusto, Velenis, Dimitrios, Heylen, Nancy, Beynet, Julien, Jung, InSoo, Woo, Jeong-Jun, Swinnen, Bart, Beyer, Gerald, Beyne, EricYear:
2012
Language:
english
DOI:
10.1109/estc.2012.6542051
File:
PDF, 980 KB
english, 2012