![](/img/cover-not-exists.png)
[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - New method for head-up display realization by mean of Chip On Board and Aerosol Jet process
Padovani, S., Sinesi, S., Priante, S., Antonipieri, M., Del Negro, A., Zoellmer, V., Maiwald, M., Hedges, M.Year:
2010
Language:
english
DOI:
10.1109/estc.2010.5642988
File:
PDF, 357 KB
english, 2010