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[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Aging effects on IMC formation and joint strength of low-Ag SAC solder/UBM (Ni (P)-Au) for WLCSP
Sun, F., Hochstenbach, P, Van Driel, W. D., Zhang, G. Q.Year:
2008
Language:
english
DOI:
10.1109/esime.2008.4525059
File:
PDF, 1.32 MB
english, 2008