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[IEEE 2012 IEEE Symposium on VLSI Technology - Honolulu, HI, USA (2012.06.12-2012.06.14)] 2012 Symposium on VLSI Technology (VLSIT) - An ultra-thin interposer utilizing 3D TSV technology
Chiou, W.C., Yang, K.F., Yeh, J.L., Wang, S.H., Liou, Y.H., Wu, T.J., Lin, J.C., Huang, C.L., Lu, S.W., Hsieh, C.C., Teng, H.A., Chiu, C.C., Chang, H.B., Wei, T.S., Lin, Y.C., Chen, Y.H., Tu, H.J., KoYear:
2012
Language:
english
DOI:
10.1109/VLSIT.2012.6242484
File:
PDF, 370 KB
english, 2012