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[IEEE 2011 IEEE International Test Conference (ITC) - Anaheim, CA, USA (2011.09.20-2011.09.22)] 2011 IEEE International Test Conference - Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon interposer base
Chi, Chun-Chuan, Marinissen, Erik Jan, Goel, Sandeep Kumar, Wu, Cheng-WenYear:
2011
Language:
english
DOI:
10.1109/test.2011.6139181
File:
PDF, 914 KB
english, 2011