[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - Design flow and methodologies for 3D systems architectures exploiting heterogeneous technologies
McIlrath, Lisa G.Year:
2012
Language:
english
DOI:
10.1109/ltb-3d.2012.6238042
File:
PDF, 686 KB
english, 2012