[IEEE Proceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, USA (7-9 June 2004)] Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) - 300mm copper low-k integration and reliability for 90 and 65 nm nodes
Parikh, S., Naik, M., Hung, R., Huixiong Dai,, Padhi, D., Zhang, L., Pan, T., Kuo-Wei Liu,, Dixit, G., Armacost, M.Year:
2004
Language:
english
DOI:
10.1109/iitc.2004.1345684
File:
PDF, 214 KB
english, 2004