[IEEE ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings - Shanghai, China (2003.10.28-2003.10.30)] Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. - FEM analysis with cyclic visco-plasticity for solder bumped flip-chip packaging
Xu Chen,, Yongcheng Lin,, Xingsheng Liu,, Guo-Quan Lu,Year:
2003
Language:
english
DOI:
10.1109/eptc.2003.1298741
File:
PDF, 400 KB
english, 2003