Electrical-Thermal Co-Simulation of 3D Integrated Systems...

IEEE Transactions on Components Packaging and Manufacturing Technology 2011 / 02 Vol. 1; Iss. 2

Electrical-Thermal Co-Simulation of 3D Integrated Systems With Micro-Fluidic Cooling and Joule Heating Effects

Xie, Jianyong, Swaminathan, Madhavan
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Volume:
1
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2010.2101770
Date:
February, 2011
File:
PDF, 1.49 MB
english, 2011
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