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[IEEE 2007 International Workshop on Junction Technology - Kyoto, Japan (2007.06.8-2007.06.9)] 2007 International Workshop on Junction Technology - Thermal Stability of Nickel Silicide with Stressed Inter-Layer Dielectric Layer on Doped Si Substrate
Zhang, Ying-Ying, Lim, Sung-Kyu, Lee, Won-Jae, Zhong, Zhun, Li, Shi-Guang, Jung, Soon-Yen, Lee, Ga-Won, Wang, Jin-Suk, Lee, Hi-DeokYear:
2007
Language:
english
DOI:
10.1109/iwjt.2007.4279959
File:
PDF, 3.04 MB
english, 2007