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[IEEE ICVC'99. 6th International Conference on VLSI and CAD - Seoul, South Korea (26-27 Oct. 1999)] ICVC '99. 6th International Conference on VLSI and CAD (Cat. No.99EX361) - Selective oxide trench etch for dual damascene process in a transformer coupled plasma system
Woo Sung Chu,, Kuk Han Yoon,, Han Sik Yoon,, Wook Hyan Koh,, Dong Seok Kim,, Jae Hyun Park,, Jae Hee Ha,Year:
1999
Language:
english
DOI:
10.1109/icvc.1999.820854
File:
PDF, 342 KB
english, 1999