[IEEE 2012 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Kyoto, Japan (2012.12.10-2012.12.12)] 2012 2nd IEEE CPMT Symposium Japan - Wide bus chip-to-chip interconnection technology using fine pitch bump joint array for 3D LSI chip stacking
Aoyagi, Masashiro, Imura, Fumito, Nemoto, Shunsuke, Watanabe, Naoya, Kato, Fumiki, Kikuchi, Katsuya, Nakagawa, Hiroshi, Hagimoto, Michiya, Uchida, Hiroyuki, Matsumoto, YukohYear:
2012
Language:
english
DOI:
10.1109/ICSJ.2012.6523418
File:
PDF, 2.39 MB
english, 2012