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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Numerical study on thermal management of LED packaging by using thermoelectric cooling
Wang, Nan, Wang, Chang-hong, Lei, Jun-xi, Zhu, Dong-shengYear:
2009
Language:
english
DOI:
10.1109/icept.2009.5270715
File:
PDF, 962 KB
english, 2009