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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Characterization of MOS transistor after through-hole electrode fabrication and 3D-assembly by mechanical caulking
Kawashita, Michihiro, Yoshimura, Yasuhiro, Tanaka, Naotaka, Shimokawa, Hirohisa, Kinoshita, Nobuhiro, Uematsu, Toshihide, Fujisawa, Masahiko, Naito, Takahiro, Akazawa, TakashiYear:
2009
Language:
english
DOI:
10.1109/ectc.2009.5074041
File:
PDF, 818 KB
english, 2009