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[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Investigation of the polymer wick structure applied to loop heat pipe
Shen-Chun Wu,, Hsieh, Bing-Han, Chien-Chih Yeh,, Chen, Yau-MingYear:
2009
Language:
english
DOI:
10.1109/impact.2009.5382187
File:
PDF, 1.59 MB
english, 2009